Crystal Boule Grinder from Mexico
Precision grinder that shapes semiconductor crystal boules to exact wafer diameters (e.g., 200mm, 300mm) and grinds orientation flats indicating conductivity type. Covered by HTS 8486.40.00 under note 11(C)(ii)(A) for wafer preparation. Ensures dimensional accuracy before slicing.
Duty Rate — Mexico → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Document achievable tolerances (micron-level) and flat grinding specs to prove semiconductor boule application
• Include wafer size compatibility certification (200mm+) distinguishing from general material grinders
• Avoid pitfalls by specifying boule handling systems designed for semiconductor crystals only