8486.40.00/Chemical Mechanical Wafer Polisher/Germany

Chemical Mechanical Wafer Polisher from Germany

CMP polisher that achieves atomic-level wafer surface flatness (<0.1nm RMS) using slurry chemistry and mechanical action. Covered by HTS 8486.40.00, note 11(C)(ii)(C) as wafer polishing apparatus. Essential final step before device fabrication.

Duty Rate — Germany → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Document achievable surface roughness and removal rates specific to silicon wafers

• Include platen design specs for 300mm wafer compatibility

• Specify endpoint detection systems for process control validation