Chemical Mechanical Wafer Polisher from China
CMP polisher that achieves atomic-level wafer surface flatness (<0.1nm RMS) using slurry chemistry and mechanical action. Covered by HTS 8486.40.00, note 11(C)(ii)(C) as wafer polishing apparatus. Essential final step before device fabrication.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Document achievable surface roughness and removal rates specific to silicon wafers
• Include platen design specs for 300mm wafer compatibility
• Specify endpoint detection systems for process control validation