Wafer Edge Gripper System from Mexico
Non-contact edge gripper for loading/unloading silicon wafers into processing chambers without surface contamination. Used in 300mm wafer fabs for high-precision handling. HTS 8486.40.0030 applies to wafer handling apparatus.
Duty Rate — Mexico → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Document edge grip precision (<0.1mm) and cleanroom class (ISO 1-3) compatibility
• Specify wafer types handled (prime, test, monitor) to validate semiconductor specificity