8486.40.00.30/Wafer Edge Gripper System/Japan

Wafer Edge Gripper System from Japan

Non-contact edge gripper for loading/unloading silicon wafers into processing chambers without surface contamination. Used in 300mm wafer fabs for high-precision handling. HTS 8486.40.0030 applies to wafer handling apparatus.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Document edge grip precision (<0.1mm) and cleanroom class (ISO 1-3) compatibility

• Specify wafer types handled (prime, test, monitor) to validate semiconductor specificity

Wafer Edge Gripper System from Japan — Import Duty Rate | HTS 8486.40.00.30