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8486.40.00.30/Wafer Edge Gripper System/Germany

Wafer Edge Gripper System from Germany

Non-contact edge gripper for loading/unloading silicon wafers into processing chambers without surface contamination. Used in 300mm wafer fabs for high-precision handling. HTS 8486.40.0030 applies to wafer handling apparatus.

Duty Rate — Germany → United States

0%

Rate breakdown

9903.05.860%Universal product exemption (U.S. note 52(b))
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Import Tips

• Document edge grip precision (<0.1mm) and cleanroom class (ISO 1-3) compatibility

• Specify wafer types handled (prime, test, monitor) to validate semiconductor specificity