Wafer Edge Gripper System from China
Non-contact edge gripper for loading/unloading silicon wafers into processing chambers without surface contamination. Used in 300mm wafer fabs for high-precision handling. HTS 8486.40.0030 applies to wafer handling apparatus.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Document edge grip precision (<0.1mm) and cleanroom class (ISO 1-3) compatibility
• Specify wafer types handled (prime, test, monitor) to validate semiconductor specificity