300mm Wafer Transfer Robot from Japan
High-precision robot for transferring 300mm silicon wafers between cluster tools in semiconductor fabs. Features dual-arm capability and EFEM (Equipment Front End Module) integration. Dedicated wafer handling under HTS 8486.40.0030.
Duty Rate — Japan → United States
0%
Rate breakdown
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Provide SECS/GEM interface specifications for fab integration proof
• Document wafer mapping and alignment precision specifications
• Distinguish from general SCARA robots by semiconductor track record