300mm Wafer Transfer Robot from China
High-precision robot for transferring 300mm silicon wafers between cluster tools in semiconductor fabs. Features dual-arm capability and EFEM (Equipment Front End Module) integration. Dedicated wafer handling under HTS 8486.40.0030.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Provide SECS/GEM interface specifications for fab integration proof
• Document wafer mapping and alignment precision specifications
• Distinguish from general SCARA robots by semiconductor track record