Wire Bonding Machine for IC Packaging from Mexico
Automated equipment that uses ultrasonic or thermosonic energy to attach gold or copper wires between semiconductor die pads and lead frame fingers. Classified under HTS 8486.40.0020 for its principal use in assembling electronic integrated circuits. Capable of ball, wedge, or stitch bonding with sub-micron precision.
Duty Rate — Mexico → United States
0%
Rate breakdown
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Provide evidence of wire diameter capabilities (≤25μm) and bonding force specs proving semiconductor suitability
• Ensure FDA/REACH compliance for cleanroom materials; contamination risks common in audits
• Avoid classifying refurbished units without recertification documentation