Tape and Reel Encapsulator for Semiconductors from Japan
Machine that seals assembled semiconductor devices in embossed carrier tape for automated handling and shipping. Under HTS 8486.40.0020 as part of electronic integrated circuit assembly process, featuring cover tape sealing and vision inspection. Prevents contamination during high-volume IC production.
Duty Rate — Japan → United States
0%
Rate breakdown
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Include tape width specs (8-72mm) and sealing pressure data confirming semiconductor standards
• ESD-safe certification required for import; static discharge common audit issue
• Avoid classifying with general packaging machines under 8422