IC Lead Frame Stripper from Japan
Automated machine that separates singulated IC packages from continuous lead frames after assembly. Falls under HTS 8486.40.0020 as essential equipment for completing semiconductor device assembly. Features vision inspection to ensure defect-free separation.
Duty Rate — Japan → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Specify lead frame pitch accuracy (≤0.1mm) and strip force control for semiconductor proof
• Anti-static materials certification mandatory for wafer-level handling
• Don't classify with general metal strip machinery under 8462