IC Lead Frame Stripper from China
Automated machine that separates singulated IC packages from continuous lead frames after assembly. Falls under HTS 8486.40.0020 as essential equipment for completing semiconductor device assembly. Features vision inspection to ensure defect-free separation.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Specify lead frame pitch accuracy (≤0.1mm) and strip force control for semiconductor proof
• Anti-static materials certification mandatory for wafer-level handling
• Don't classify with general metal strip machinery under 8462