8486.40.00.20/Flip Chip Bonder for Semiconductor Devices/Mexico

Flip Chip Bonder for Semiconductor Devices from Mexico

High-precision equipment that aligns and bonds flipped semiconductor dies to substrates using solder bumps or conductive adhesives. Falls under HTS 8486.40.0020 due to its specialized role in advanced IC packaging processes like 3D stacking. Features thermocompression and reflow capabilities for high-density interconnects.

Duty Rate — Mexico → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Document bump pitch accuracy (≤40μm) and alignment tolerances to distinguish from general bonders

• Include cleanroom certification (ISO 3-5) in import filings for semiconductor classification

Flip Chip Bonder for Semiconductor Devices from Mexico — Import Duty Rate | HTS 8486.40.00.20