Flip Chip Bonder for Semiconductor Devices from Japan
High-precision equipment that aligns and bonds flipped semiconductor dies to substrates using solder bumps or conductive adhesives. Falls under HTS 8486.40.0020 due to its specialized role in advanced IC packaging processes like 3D stacking. Features thermocompression and reflow capabilities for high-density interconnects.
Duty Rate — Japan → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Document bump pitch accuracy (≤40μm) and alignment tolerances to distinguish from general bonders
• Include cleanroom certification (ISO 3-5) in import filings for semiconductor classification