Flip Chip Bonder for Semiconductor Devices from China
High-precision equipment that aligns and bonds flipped semiconductor dies to substrates using solder bumps or conductive adhesives. Falls under HTS 8486.40.0020 due to its specialized role in advanced IC packaging processes like 3D stacking. Features thermocompression and reflow capabilities for high-density interconnects.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Document bump pitch accuracy (≤40μm) and alignment tolerances to distinguish from general bonders
• Include cleanroom certification (ISO 3-5) in import filings for semiconductor classification