Die Bonder Machine for Semiconductor Assembly from Japan
A precision machine that picks and places semiconductor dies onto lead frames or substrates using epoxy or eutectic bonding methods. It falls under HTS 8486.40.0020 as it is specifically designed for assembling semiconductor devices during electronic integrated circuit production. High-speed models handle thousands of dies per hour with micron-level accuracy.
Duty Rate — Japan → United States
0%
Rate breakdown
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Verify equipment is dedicated to semiconductor assembly via technical specs; general-purpose bonders classify elsewhere
• Include detailed user manuals and process flow diagrams in documentation to prove Note 11(C) applicability