Plasma Etching Reactor for TFT Panels from China
Reactive ion etching system removes material from TFT layers on glass substrates using plasma in flat panel display production. Falls under HTS 8486.30.00.00 as apparatus solely for FPD manufacturing, ensuring precise pattern definition. Critical for creating high-density transistor arrays in LCDs.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Provide process recipes proving FPD-specific etch chemistries; avoid general plasma cleaner claims
• Common issue: missing safety certifications for high-voltage plasma systems
• Partner with customs brokers experienced in Chapter 84 tech imports