Semiconductor Wafer Grinder Gasket Kit from Japan
Assortment of precision multi-layer metal gaskets with PTFE coating for sealing chambers in wafer grinding machines used in semiconductor fabrication. Classified in 8484.90.00.00 as dissimilar gasket sets in pouches, designed for cleanroom compatibility in crystal boule processing equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide end-use statement linking to semiconductor processing to support cleanroom material claims
• Sets must be pre-packaged; loose gaskets risk reclassification to 8484.10 or Chapter 39
• Avoid delays by certifying particle-free packaging suitable for wafer fab environments