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8484.20.00.00/Wafer Slicing Saw Coolant Mechanical Seal/Mexico

Wafer Slicing Saw Coolant Mechanical Seal from Mexico

Mechanical seal containing diamond slurry coolant in wire saws slicing semiconductor wafers from boules. Under HTS 8484.20.00.00 statistical provisions for wafer preparation equipment. Ensures precise kerf-less slicing.

Duty Rate — Mexico → United States

13.9%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Diamond slurry compatibility certification essential

• Abrasion-resistant face materials documented

• Reference wafer slicing statistical note