Wafer Slicing Saw Coolant Mechanical Seal from Japan
Mechanical seal containing diamond slurry coolant in wire saws slicing semiconductor wafers from boules. Under HTS 8484.20.00.00 statistical provisions for wafer preparation equipment. Ensures precise kerf-less slicing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Diamond slurry compatibility certification essential
• Abrasion-resistant face materials documented
• Reference wafer slicing statistical note