8484.20.00.00/Wafer Slicing Saw Coolant Mechanical Seal/Japan

Wafer Slicing Saw Coolant Mechanical Seal from Japan

Mechanical seal containing diamond slurry coolant in wire saws slicing semiconductor wafers from boules. Under HTS 8484.20.00.00 statistical provisions for wafer preparation equipment. Ensures precise kerf-less slicing.

Duty Rate — Japan → United States

13.9%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Diamond slurry compatibility certification essential

• Abrasion-resistant face materials documented

• Reference wafer slicing statistical note

Wafer Slicing Saw Coolant Mechanical Seal from Japan — Import Duty Rate | HTS 8484.20.00.00