Wafer Slicing Saw Coolant Mechanical Seal from Germany
Mechanical seal containing diamond slurry coolant in wire saws slicing semiconductor wafers from boules. Under HTS 8484.20.00.00 statistical provisions for wafer preparation equipment. Ensures precise kerf-less slicing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Diamond slurry compatibility certification essential
• Abrasion-resistant face materials documented
• Reference wafer slicing statistical note