Wafer Slicing Saw Coolant Mechanical Seal from Germany
Mechanical seal containing diamond slurry coolant in wire saws slicing semiconductor wafers from boules. Under HTS 8484.20.00.00 statistical provisions for wafer preparation equipment. Ensures precise kerf-less slicing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Diamond slurry compatibility certification essential
• Abrasion-resistant face materials documented
• Reference wafer slicing statistical note