Wafer Grinder Spindle Mechanical Seal from Japan
Precision mechanical seal for semiconductor wafer grinder spindles, preventing slurry contamination. Falls under HTS 8484.20.00.00 as mechanical seal, with statistical note recognition for semiconductor processing. Maintains flatness during crystal grinding.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Reference statistical note for semiconductor apparatus classification
• Cleanroom packaging certification required
• Particle generation specs in technical documentation