8484.20.00.00/Silicon Wafer Lapper Mechanical Seal/Japan

Silicon Wafer Lapper Mechanical Seal from Japan

Mechanical seal for lapping machine platens processing silicon wafers to exact thickness tolerances. HTS 8484.20.00.00 for semiconductor wafer preparation per statistical notes. Critical for surface flatness before polishing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Calculate with your customs value Verify classification with AI

Import Tips

• Thickness tolerance specs (±0.5 micron) in documentation

• Colloidal silica slurry containment proof

• Class 100 cleanroom compatibility