8484.20.00.00/Silicon Wafer Lapper Mechanical Seal/Japan

Silicon Wafer Lapper Mechanical Seal from Japan

Mechanical seal for lapping machine platens processing silicon wafers to exact thickness tolerances. HTS 8484.20.00.00 for semiconductor wafer preparation per statistical notes. Critical for surface flatness before polishing.

Duty Rate — Japan → United States

13.9%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Thickness tolerance specs (±0.5 micron) in documentation

• Colloidal silica slurry containment proof

• Class 100 cleanroom compatibility

Silicon Wafer Lapper Mechanical Seal from Japan — Import Duty Rate | HTS 8484.20.00.00