Silicon Wafer Lapper Mechanical Seal from Japan
Mechanical seal for lapping machine platens processing silicon wafers to exact thickness tolerances. HTS 8484.20.00.00 for semiconductor wafer preparation per statistical notes. Critical for surface flatness before polishing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Thickness tolerance specs (±0.5 micron) in documentation
• Colloidal silica slurry containment proof
• Class 100 cleanroom compatibility