Gallium Arsenide Wafer Polisher Seal from Japan
Mechanical seal for chemical mechanical polishing (CMP) of GaAs compound semiconductor wafers. Classified HTS 8484.20.00.00 under semiconductor statistical notes for wafer preparation equipment. Uses alkaline slurries for mirror finish.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify GaAs compatibility and CMP slurry type
• Defect density specs (<0.1 defects/cm²)
• Hazardous chemical resistance certification