Gallium Arsenide Wafer Polisher Seal from Japan
Mechanical seal for chemical mechanical polishing (CMP) of GaAs compound semiconductor wafers. Classified HTS 8484.20.00.00 under semiconductor statistical notes for wafer preparation equipment. Uses alkaline slurries for mirror finish.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify GaAs compatibility and CMP slurry type
• Defect density specs (<0.1 defects/cm²)
• Hazardous chemical resistance certification