Gallium Arsenide Wafer Polisher Seal from China
Mechanical seal for chemical mechanical polishing (CMP) of GaAs compound semiconductor wafers. Classified HTS 8484.20.00.00 under semiconductor statistical notes for wafer preparation equipment. Uses alkaline slurries for mirror finish.
Duty Rate — China → United States
41.4%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Specify GaAs compatibility and CMP slurry type
• Defect density specs (<0.1 defects/cm²)
• Hazardous chemical resistance certification