Wafer Slicing Saw Speed Controller from Japan
Mechanical speed changer regulating diamond saw blade RPM for slicing semiconductor wafers from boules. HTS 8486.40.70.00 per statistical note (a)(ii)(B) wafer slicing equipment. Ensures precise kerf width and surface quality.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Cite statistical note reference for wafer slicing saws in entry docs
• Blade RPM tolerance specs critical for classification
• Avoid generic saw classification missing semiconductor provisions