Wafer Lapping/Polishing Speed Controller from Japan
Mechanical speed changer maintaining constant surface speed during semiconductor wafer lapping/polishing. Statistical note (a)(ii)(C) coverage under HTS 8486.40.70.00. Critical for wafer flatness within nanometer tolerances.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Cite statistical note reference for lappers/polishers
• Flatness tolerance specs (bow/warp) justify semiconductor use
• Slurry compatibility documentation for process verification