Wafer Lapping/Polishing Speed Controller from China
Mechanical speed changer maintaining constant surface speed during semiconductor wafer lapping/polishing. Statistical note (a)(ii)(C) coverage under HTS 8486.40.70.00. Critical for wafer flatness within nanometer tolerances.
Duty Rate — China → United States
41.4%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Cite statistical note reference for lappers/polishers
• Flatness tolerance specs (bow/warp) justify semiconductor use
• Slurry compatibility documentation for process verification