8483.40.50/Wafer Grinder Spindle Speed Changer/Japan

Wafer Grinder Spindle Speed Changer from Japan

Manual multi-speed gearbox for semiconductor wafer grinding equipment spindle drive. Allows precise RPM selection for different grind/lap/polish stages. HTS 8483.40.50 as manually operated speed changer.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify surface finish capabilities (Ra < 1 nm) and flatness tolerances

• Include vibration isolation specs for semiconductor cleanroom use

• Verify separability from grinder head to maintain standalone classification