Wafer Grinder Spindle Speed Changer from China
Manual multi-speed gearbox for semiconductor wafer grinding equipment spindle drive. Allows precise RPM selection for different grind/lap/polish stages. HTS 8483.40.50 as manually operated speed changer.
Duty Rate — China → United States
40%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Specify surface finish capabilities (Ra < 1 nm) and flatness tolerances
• Include vibration isolation specs for semiconductor cleanroom use
• Verify separability from grinder head to maintain standalone classification