Titanium Plain Shaft Bushing for Wafer Slicer Drive from Germany
Lightweight Grade 5 titanium plain shaft bushing without housing, enduring high RPM in drive shafts of wafer slicing saws for semiconductor boule slicing. Classified HTS 8483.30.8090 for plain shaft bearings in semiconductor wafer manufacturing.
Duty Rate — Germany → United States
14.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit titanium alloy cert (Ti-6Al-4V) and machining drawings for classification
• Monitor aerospace cross-over; declare semiconductor end-use clearly
• Check ITAR restrictions if dual-use potential