Titanium Plain Shaft Bushing for Wafer Slicer Drive from Germany
Lightweight Grade 5 titanium plain shaft bushing without housing, enduring high RPM in drive shafts of wafer slicing saws for semiconductor boule slicing. Classified HTS 8483.30.8090 for plain shaft bearings in semiconductor wafer manufacturing.
Duty Rate — Germany → United States
29.5%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Submit titanium alloy cert (Ti-6Al-4V) and machining drawings for classification
• Monitor aerospace cross-over; declare semiconductor end-use clearly
• Check ITAR restrictions if dual-use potential