PTFE-Lined Bushing for Wafer Slicing Saw Spindle from Japan
A low-friction PTFE-lined steel plain shaft bearing without housing, fitted on spindles of wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers. It qualifies for HTS 8483.30.8090 as an unlubricated plain shaft bearing optimized for cleanroom semiconductor fabrication.
Duty Rate — Japan → United States
29.5%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Document PTFE lining thickness and cleanroom compatibility to distinguish from basic plastic articles
• Avoid bundling with saw housing to prevent classification as complete bearing housing assembly
• Comply with REACH/RoHS for PTFE materials in electronics supply chain