Precision Spherical Plain Bearing for Wafer Handlers from Japan
Ultra-precision spherical plain bearing without housing for semiconductor wafer handling robots, minimizing particle generation. HTS 8483.30.8070 as spherical plain shaft bearing. Ceramic-hybrid construction for cleanroom use.
Duty Rate — Japan → United States
29.5%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Provide cleanroom certification (ISO 3) and particle specs
• Note statistical provisions; may qualify for semiconductor equipment exclusions
• Declare as individual components, not robot subassemblies