Semiconductor Wafer Polisher Rod End Bearing from Japan
Specialized rod end bearing for linkage in wafer grinding/polishing equipment, with cleanroom-compatible housing. Statistical notes align with HTS 8486.10.8055 for housed plain bearings.
Duty Rate — Japan → United States
29.5%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Semiconductor equipment end-use statement prevents duty drawback issues
• Contamination-free packaging certification required