Wafer Slicing Saw Spindle Bearing from Mexico
Housed angular contact ball bearing for inner diamond wafer slicing saw spindles in semiconductor fabs. HTS 8483.20.80 'other' for specialized housed designs in boule slicing equipment. Maintains micron-level thickness control.
Duty Rate — Mexico → United States
29.5%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Cite statistical note (b)(ii)(B) for wafer slicing saw classification support
• Provide spindle RPM (10,000+) and runout specs (<0.5µm)
• Cleanroom packaging mandatory; declare ESD-safe materials