8483.20.80/Wafer Slicing Saw Spindle Bearing/Germany

Wafer Slicing Saw Spindle Bearing from Germany

Housed angular contact ball bearing for inner diamond wafer slicing saw spindles in semiconductor fabs. HTS 8483.20.80 'other' for specialized housed designs in boule slicing equipment. Maintains micron-level thickness control.

Duty Rate — Germany → United States

14.5%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Cite statistical note (b)(ii)(B) for wafer slicing saw classification support

• Provide spindle RPM (10,000+) and runout specs (<0.5µm)

• Cleanroom packaging mandatory; declare ESD-safe materials

Wafer Slicing Saw Spindle Bearing from Germany — Import Duty Rate | HTS 8483.20.80