Wafer Slicing Saw Spindle Bearing from China
Housed angular contact ball bearing for inner diamond wafer slicing saw spindles in semiconductor fabs. HTS 8483.20.80 'other' for specialized housed designs in boule slicing equipment. Maintains micron-level thickness control.
Duty Rate — China → United States
39.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Cite statistical note (b)(ii)(B) for wafer slicing saw classification support
• Provide spindle RPM (10,000+) and runout specs (<0.5µm)
• Cleanroom packaging mandatory; declare ESD-safe materials