Wafer Slicing Saw Spindle Bearing from Canada
Housed angular contact ball bearing for inner diamond wafer slicing saw spindles in semiconductor fabs. HTS 8483.20.80 'other' for specialized housed designs in boule slicing equipment. Maintains micron-level thickness control.
Duty Rate — Canada → United States
29.5%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Cite statistical note (b)(ii)(B) for wafer slicing saw classification support
• Provide spindle RPM (10,000+) and runout specs (<0.5µm)
• Cleanroom packaging mandatory; declare ESD-safe materials