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Crystal Grinder Wafer Bearing Housing from Germany

Specialized housed ball bearing for semiconductor crystal grinders that shape silicon boules to wafer diameter. Classified HTS 8483.20.80 as other housed bearings used in wafer manufacturing equipment per statistical notes. Ensures flatness indication grinding.

Duty Rate — Germany → United States

29.5%

Rate breakdown

9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter

Import Tips

Reference statistical note (b)(ii)(A) in entry docs to support semiconductor classification

Class 100 cleanroom compatibility certification required

Avoid Chapter 84 machine part declaration; emphasize standalone precision function