Crystal Grinder Wafer Bearing Housing from Germany
Specialized housed ball bearing for semiconductor crystal grinders that shape silicon boules to wafer diameter. Classified HTS 8483.20.80 as other housed bearings used in wafer manufacturing equipment per statistical notes. Ensures flatness indication grinding.
Duty Rate — Germany → United States
29.5%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Reference statistical note (b)(ii)(A) in entry docs to support semiconductor classification
• Class 100 cleanroom compatibility certification required
• Avoid Chapter 84 machine part declaration; emphasize standalone precision function