Crystal Grinder Wafer Bearing Housing from Germany
Specialized housed ball bearing for semiconductor crystal grinders that shape silicon boules to wafer diameter. Classified HTS 8483.20.80 as other housed bearings used in wafer manufacturing equipment per statistical notes. Ensures flatness indication grinding.
Duty Rate — Germany → United States
14.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Reference statistical note (b)(ii)(A) in entry docs to support semiconductor classification
• Class 100 cleanroom compatibility certification required
• Avoid Chapter 84 machine part declaration; emphasize standalone precision function