Roller Bearing Housed Unit for Wafer Saws from Japan
Precision housed roller bearing designed for high-speed wafer slicing saws in semiconductor production. Falls under HTS 8483.20.8080 as other incorporating roller bearings for specialized machinery. Ensures ultra-flat rotation.
Duty Rate — Japan → United States
14.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include end-use statement for semiconductor; statistical note verification key
• Cleanroom compatibility certification