Roller Bearing Housed Unit for Wafer Saws from Japan
Precision housed roller bearing designed for high-speed wafer slicing saws in semiconductor production. Falls under HTS 8483.20.8080 as other incorporating roller bearings for specialized machinery. Ensures ultra-flat rotation.
Duty Rate — Japan → United States
29.5%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Include end-use statement for semiconductor; statistical note verification key
• Cleanroom compatibility certification