Deep Groove Ball Bearing Inner Ring for Wafer Polishers from Japan
Inner ring component for deep groove ball bearings in wafer polishers ensuring mirror-finish surfaces for semiconductor processing. Classified in HTS 8482.99.65.95 for parts used in semiconductor wafer preparation.
Duty Rate — Japan → United States
15.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Reference Chapter 84 statistical notes in commercial invoice for semiconductor-specific duty treatment
• Certify materials for contamination-free semiconductor environments