Deep Groove Ball Bearing Inner Ring for Wafer Polishers from Japan
Inner ring component for deep groove ball bearings in wafer polishers ensuring mirror-finish surfaces for semiconductor processing. Classified in HTS 8482.99.65.95 for parts used in semiconductor wafer preparation.
Duty Rate — Japan → United States
30.8%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Reference Chapter 84 statistical notes in commercial invoice for semiconductor-specific duty treatment
• Certify materials for contamination-free semiconductor environments