Angular Contact Ball Bearing Retainer for Wafer Slicing Saws from Germany
A high-precision retainer for angular contact ball bearings in wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers. Classified under HTS 8482.99.65.95 as other bearing parts specialized for semiconductor wafer preparation equipment.
Duty Rate — Germany → United States
15.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document saw's role in semiconductor wafer production with manufacturer specs to support statistical note classification
• Ensure RoHS compliance and material certificates for cleanroom compatibility during customs clearance