Angular Contact Ball Bearing Retainer for Wafer Slicing Saws from Germany
A high-precision retainer for angular contact ball bearings in wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers. Classified under HTS 8482.99.65.95 as other bearing parts specialized for semiconductor wafer preparation equipment.
Duty Rate — Germany → United States
30.8%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Document saw's role in semiconductor wafer production with manufacturer specs to support statistical note classification
• Ensure RoHS compliance and material certificates for cleanroom compatibility during customs clearance