Angular Contact Ball Bearing Retainer for Wafer Slicing Saws from Canada
A high-precision retainer for angular contact ball bearings in wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers. Classified under HTS 8482.99.65.95 as other bearing parts specialized for semiconductor wafer preparation equipment.
Duty Rate — Canada → United States
30.8%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document saw's role in semiconductor wafer production with manufacturer specs to support statistical note classification
• Ensure RoHS compliance and material certificates for cleanroom compatibility during customs clearance