Ball Bearing Shield Seal from Japan
Metal or polymer shield that protects ball bearing internals from contaminants while allowing low-friction operation. HTS 8482.99.3500 covers such parts integral to ball bearing function. Used in cleanroom environments for semiconductor wafer processing.
Duty Rate — Japan → United States
19.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify shield attachment method (snap-fit, press-fit) to prove bearing specificity
• Cleanroom certification may be required for semiconductor end-use validation