High-Speed Outer Race for Wafer Lapping Machines from Japan
Special alloy steel outer race for lapping machines that polish semiconductor wafers to mirror finish before device fabrication. 8482.99.2580 as other outer ring for semiconductor wafer preparation bearings operating at 3000+ RPM. Ensures uniform material removal across 300mm wafers.
Duty Rate — Japan → United States
30.8%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Specify RPM rating and thermal expansion coefficients; provide lapping machine compatibility certification; ensure proper heat treatment documentation (58-62 HRC)