High-Speed Outer Race for Wafer Lapping Machines from Germany
Special alloy steel outer race for lapping machines that polish semiconductor wafers to mirror finish before device fabrication. 8482.99.2580 as other outer ring for semiconductor wafer preparation bearings operating at 3000+ RPM. Ensures uniform material removal across 300mm wafers.
Duty Rate — Germany → United States
15.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify RPM rating and thermal expansion coefficients; provide lapping machine compatibility certification; ensure proper heat treatment documentation (58-62 HRC)