Ceramic Hybrid Inner Race for Wafer Grinder Spindles from Germany
Silicon nitride ceramic inner race paired with steel balls for high-speed wafer grinders that achieve dimensional tolerances on semiconductor wafers. Classified in 8482.99.2580 as other inner ring for semiconductor manufacturing bearings requiring extreme flatness and wear resistance. Used in back-grinding processes for wafer thinning.
Duty Rate — Germany → United States
30.8%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Include ceramic material test reports (ASTM C1161); specify hybrid bearing design in commercial invoice; watch for anti-dumping duties on ceramic components from certain origins