Ceramic Hybrid Inner Race for Wafer Grinder Spindles from China
Silicon nitride ceramic inner race paired with steel balls for high-speed wafer grinders that achieve dimensional tolerances on semiconductor wafers. Classified in 8482.99.2580 as other inner ring for semiconductor manufacturing bearings requiring extreme flatness and wear resistance. Used in back-grinding processes for wafer thinning.
Duty Rate — China → United States
40.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include ceramic material test reports (ASTM C1161); specify hybrid bearing design in commercial invoice; watch for anti-dumping duties on ceramic components from certain origins