Semiconductor Wafer Lapping Machine Outer Bearing Race from Germany
Outer race optimized for cylindrical roller bearings in lapping machines that achieve ultra-flat wafer surfaces for semiconductor device fabrication. Withstands abrasive slurry conditions while maintaining sub-micron precision. HTS 8482.99.2560 applies to such other cylindrical roller bearing outer rings.
Duty Rate — Germany → United States
30.8%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document corrosion resistance for slurry environments to support semiconductor processing classification
• Provide equipment OEM specifications linking race to identified wafer lapping apparatus
• Ensure no pre-installation; loose races classify separately from assembled bearings